Interposer(Board Saver)

  • Purpose: A solution designed to prevent damage to board pads during semiconductor testing
  • Cost Reduction: Minimizes the need for pad replacement and repair, lowering long-term operational expenses
  • Protection Mechanism: Distributes force evenly and uses durable materials to prevent damage from friction and impact
  • Value & ROI: Extends pad lifespan, reduces maintenance costs, and improves productivity

Specifications

Pitching
0.30mm & Above
Overall thickness
0.1mm
Plating
GOLD PLATED
C-res
< 60mOhm
Current
1.0A
Temperature
-55DegC ~ 200 DegC
Material
PI FILM

㈜티에프이 / 본사

경기도 화성시 병점구 반월길 50-8 (우 : 18384)

289-1 Yaenda, Hidaka City, Saitama, Japan (日 : 〒350-1236 埼玉県日高市猿田289-1)


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